Technology

Press Processing

The amazing thing about Yutaka's stamping technologies

Yutaka has a system in place for mass production of stamped products with its own dies.
Yutaka can offer optimal process design with various thicknesses, materials, and production systems, that incorporates CAE (analytical technique).

Technology

Products

Laminating press

Yutaka is producing T-core products through high-precision, high-speed stamping based on one-point riveting lamination, which is Yutaka's own manufacturing process.

Yutaka has achieved a bolster size (machine specification) of 3,360 mm × 1,200 mm through composite lamination production with high-precision, high-speed large presses.

With large precision surface grinding machines and ultrasonic washing machines, Yutaka has established a maintenance method by which everything is completed within.

Equipment

MSP-4000
Bolster size 3360×1200
MSP-2200
Bolster size 2000×1000
Large precision surface grinding machine
Ultrasonic washing machine

Self-manufacture of dies

Yutaka now manufactures its own laminating dies, which includes the processes of Die design → Precision processing of parts → Die adjustment → Mass production.
Yutaka is working hard to enhance its technical capabilities and competitiveness through enhancement of its ability to come up with ideas for new manufacturing processes and new structures and proposal of low-cost manufacturing processes.

Why does Yutaka manufacture its own dies?

Yutaka’s ownership is evidence of continual technical capabilities.

Enhancing new manufacturing processes, and new structures, and offering VA proposals

Establishing a global backup framework

Maintaining and managing stable mass production and implementing improvement measures completely on its own

Low-cost dies

Embodying its cost reduction concept and strengthening its ability to work with manufacturers

Human resource development

Early training and education based on “genba” (actual place), “genbutsu” (actual thing) and “genjitsu” (actual situation)

Equipment

CAE/die design
Precision processing
Adjustment/measurement
Trial/mass production

Precision processing

Yutaka's large processing machines enable us to processing large parts precisely (±2 μm). Processable range 1,580 mm × 1,020 mm

Yutaka has achieved a processing precision of ±1 μm through ultra-high precision processing with wire-discharge processing machines.

High-precision processing has been achieved through the accumulation of processing knowhow by experienced operators.

Equipment

Maximum processable range: X1,580 mm Y1,020 mm
Processing precision: ±2 μm
Temperature control: 23°C±1°C
High-precision die parts processing (punch die)
Temperature control: 23°C±1°C
Maximum processable range: X800 mm Y600 mm (water type)
Processing precision: ±2 μm
Temperature control: 23°C±1°C
Chuck dimensions: X800 mm Y400 mm
Processing precision: ±2 μm
Temperature control: 23°C±1°C

Precision measurement

With the experienced operator’s measurement precision of ±1 μm, micron-precision three-dimensional measurement is possible.

The temperature and humidity are controlled at 20°C±1°C and 50%±10%, offering a good measurement environment.

Extremely small styluses with a minimum diameter of 30 μm have enabled touch measurement of extremely small shapes, thereby enabling measurement of extremely small radiuses.

Equipment

Tokyo Seimitsu
Coordinate measuring machine
Mitsutoyo
Quick Vision
Mitsutoyo
Contour tracer
Constant-temperature chamber

CAE analysis

Through die process design, and press CAE, it is possible to analyze product wrinkles, cracks, and spring back in plate stamping.

Through die design with die structure CAE, it is possible to analyze die deformation, deflection, and stress.

By reflecting product shapes obtained by welding CAE in dies, it is possible to analyze thermal distortion, heat transfer, and temperature distribution after product welding.